What’s QSOP Package?
Quarter-Size Small Outline Package (QSOP) is a small rectangular surface-mount plastic package with gull wing leads protruding out of its longer sides. The Quarter-size SOP comes in two standard body widths: the narrow body which has a nominal body thickness of 150 mils and the wide body which has a nominal body thickness of 300 mils. Typical lead counts range from 16 to 28 leads for the narrow body and 36 to 44 leads for the wide body. The lead pitch is typically 25 mils.
Quarter Size Outline Package (QSOP)
| Properties of Some Examples | ||||
| Part Number | No. of Pins | Body Size | Body Thickness | Lead Pitch |
| QSOP-16 | 16 | 150 x 192 mils | 55 mils | 25 mils |
| QSOP-20 | 20 | 150 x 340 mils | 55 mils | 25 mils |
| QSOP-24 | 24 | 150 x 340 mils | 55 mils | 25 mils |
| QSOP-28 | 28 | 150 x 390 mils | 55 mils | 25 mils |
Quarter-size SOP is leadframe based, plastic encapsulated package that is well suited for applications requiring optimum performance in IC packaging with compressed body size and tightened lead pitch. This industry-standard IC package yield a significant reduction in size while running in high volume and provide value-added, low-cost solutions for a wide range of applications.
Features
- Cu wire interconnect for the lowest cost
- Standard JEDEC package outlines
- Multi-die production capability
- Turnkey test services, including strip test options
- Green materials are standard – Pb-free and RoHS compliant
- Stealth dicing (narrow saw streets)
- Larger/higher density leadframe strips
- Leadframe roughing for improved MSL capability
See Chip Package, IC, SOIC, SOP, TSOP, SSOP, TSSOP, and VSOP. Turnkey PCB assembly with components sourcing service at MADPCB.