Any Layer HDI PCB Microvia III-Any Layer Microvia

Any Layer HDI PCBs are those multilayer PCBs that enable free connection between all layers combing laser technology and filled plating technology that allows ultra-fine processing. So Any Layer HDI PCB Microvia III-Any Layer Microvia With the higher degree of design freedom and higher-density wiring, these PCBs are ideal for the needs of downsizing and thinning of smartphones and other high-performance electronic devices.

Features 

• Any layer HDI PCBs with laser via and filled plating on each layer
• Thinner 0.4mm pitch CSP by any layer interconnection supported
• Mass-production of 10-layer μVia III (AnyLayer PCBs) for mobile devices

Applications 

Industry demand for smaller products demands higher circuitry density in circuit boards. Any-Layer Vias span a wide range of industries such as Automotive, Industrial/Consumer and Telecom.

 

Cross-Section

 

Stack-up 

 

Design Rule 

Parameter			Symbol	Standard Spec (μm)	Min Spec (μm)
Trace Width/Spacing	HDI Layer		A/A’	75/75	50/50
Plated Through Hole	Pad Diameter	Outer Layer	B	300	250
		Inner Layer	C	550	450
Laser Via	Via Diameter		E	100	75
	Pad Diameter		F	250	220
Dielectric Thickness	HDI Layer		G	60	40
	Core Layer		H	60	50
PCB Thickness	6-Layer		I	440
	8-Layer			590
	10-Layer			740

 

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