TEPBGA, or TE-PBGA (Thermally Enhanced Plastic Ball Grid Array) package is variant of the PGBA package for enhanced thermal dissipation. The figure below shows a drop-in heat slug is added to a 4-layer PBGA with 2oz (70μm) copper on the inner layers. This provides a much better thermal path to top surface of the package. The heat slug can be grounded to provide an EMI shield for the package. Thermal vias are provided under the die and are typically connected to the package ground plane thereby conducting the heat to the PCB ground plane.
Cross-Sectional View of 4 Layer TEPBGA
TEPBGA packages incorporate the most advanced assembly processes and designs for cost/performance applications. This advanced IC package technology allows application and design engineers to optimize innovations while maximizing the performance characteristics of semiconductors.
Also see PBGA