Ultra Thin Quad Flat Non-Leaded Package (UQFN or UTQFN) is a very small and thin square-shaped or rectangular surface-mount plastic package with no leads. Instead of leads, it uses metal pads around the periphery of the package body for electrical connection to the outside world. It is basically a thinner version of the thin quad flat no leads (TQFN) package.
Ultra Thin Quad Flat Non-Leaded Package (UQFN or UTQFN)
Typical UQFN pad counts range from 6 to 28. The body thickness of UQFN packages typically ranges from 0.50mm to 0.60mm. The pad pitch (distance between pads) used by UQFN packages is usually either 0.4mm or 0.5mm.
| Properties of Some Examples of UQFN | |||
| No. of Pads | Body Size | Body Thickness | Pad Pitch |
| 10 | 1.4 mm x 1.8 mm | 0.5 mm | 0.4 mm |
| 10 | 1.6 mm x 2.1 mm | 0.5 mm | 0.5 mm |
| 16 | 3 mm x 3 mm | 0.55 mm | 0.5 mm |
| 20 | 3 mm x 4 mm | 0.55 mm | 0.5 mm |
| 24 | 4 mm x 4 mm | 0.55 mm | 0.5 mm |
| 28 | 4 mm x 4 mm | 0.55 mm | 0.4 mm |
The pads are underneath the ultra thin QFN package, and are not visible from the top of the SMD assembly. For detect the mounting quality, need to get the assistance of X-ray or AXI. The aperture of the middle big pad on SMT stencil requires special opening with solder paste volume control.
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