TSSOP

Thin Shrink Small Outline Package (TSSOP) is a rectangular surface mount plastic integrated circuit (IC) package with gull-wing leads. They are suited for applications requiring 1 mm or less mounted height and are commonly used in analog and operation amplifiers, controllers and Drivers, Logic, Memory, and RF/Wireless, Disk drives, video/audio and consumer electronics.

 

TSSOP has a smaller body and smaller lead pitch than the standard SOIC package. It is also smaller and thinner than a TSOP with the same lead count. The TSSOP come in body sizes of 3.0mm, 4.4mm and 6.1mm. The 3.0-mm TSSOP body has a typical thickness of 0.85 mm while the 4.4 mm- and 6.1-mm bodies have a typical thickness of 0.9 mm. TSSOP lead counts range from 8 to 56. The standard lead pitch used by TSSOP’s is 0.65mm.

Some TSSOP packages have an exposed pad. This is a rectangular metal pad on the bottom side of the package. The exposed pad will be soldered on the printed circuit board (PCB) to transfer heat from the package to the PCB. In most applications, the exposed pad is connected to ground. The Heat sink thin shrink small outline package (HTSSOP) is Texas Instruments name for a TSSOP with an exposed pad on the bottom side. There are some other manufacturers who uses the same name.

This package type is JEDEC-compliant. The table below shows a partial list of TSSOP package options.

Part Number	No. of Pins	Body Width	Pitch	Qty Per Tube	Tape Width	Tape Pitch	Qty/Reel
TSSOP8/10	44053	3.0mm	.65mm	12mm	8mm	98	2,500
TSSOP14	14	4.4mm	.65mm	12/16mm	8mm	96	1,000/2,500
TSSOP28	28	4.4mm	.65mm	16mm	8/12mm	50	1,000
TSSOP28/32	28/32	6.1mm	.65mm	24mm	12mm	50/44	1,000
TSSOP38	38	6.1mm	.65mm	24mm	12mm	39	1,000
TSSOP48/56	48/56	6.1mm	.5mm	24mm	12mm	39/35	1,000
TSSOP56	56	4.4mm	.4mm	24mm	12mm	42	1,000
TSSOP64	64	6.1mm	.5mm	N/A	N/A	28	N/A
TSSOP80	80	6.1mm	.4mm	N/A	N/A	28	N/A

 

See Chip Package, IC, SOIC, SOP, TSOP, SSOP, QSOP and VSOP. Turnkey PCB assembly with components sourcing service at MADPCB.