Electronic Glossary

The ratio of a quantity change of an electrical parameter, such as resistance or capacitance, of an electronic component to the original value when temperature changes, expressed in %/degree C or ppm/degree C.

Ability of a solder joint to resist a force applied perpendicular (upward) from it.

What’s Tented Via in PCB?   A Tented Via is defined as a via that is completely covered by the solder mask in printed circuit board. Tented vias are very popular because they have the lowest cost. Tenting can be used on …

TEPBGA, or TE-PBGA (Thermally Enhanced Plastic Ball Grid Array) package is variant of the PGBA package for enhanced thermal dissipation. The figure below shows a drop-in heat slug is added to a 4-layer PBGA with 2oz (70μm) copper on the …

A point of connection for two or more conductors in an electrical circuit; one of the conductors is usually an electrical contact or lead of a component.

Test Coupon: What you need to know An area of patterns on the same fabrication panel as the PCB, but separate from the electrical circuits and outside the actual board outline. It is cut away from the board prior to …

Designated points of access to a circuit or component for testing purposes. See Test Point.

A specific point in a printed circuit board used for specific testing for functional adjustment or quality test in the circuit-based device.

In PCB manufacturing and PCB assembly, Testing is a method for determining whether a bare PCB and/or a PCB assembly (PCBA) conforms to a set of parameter and functional specifications. The circuit board is a top-quality product that should not …

What’s TFBGA Package?   Thin Profile Fine-Pitch Ball Grid Array (TFBGA) is a thinner version of the FBGA package. Like all BGA packages, thin profile fine pitch BGAs use solder balls that are arranged in a grid or array at …