Electronic Glossary

What’s DPC (Direct Plated Copper)?   DPC (Direct Plated Copper) involves phys­ical vapor depos­ition (PVD) method – Sputtering under high temperature and pressure conditions to plate the copper to substrates. DPC is the most advanced process in manufacturing ceramic substrate …

Dynamic Random Access Memory (DRAM, or Dynamic RAM) is a type of semiconductor volatile memory that is typically used for the data or program code needed by a computer processor to function.

PCB Design Rule Check (DRC), more commonly called as DRC in the PCB industry, is a design process to determine if the layout satisfies a number of rules, and also a CAM process to determine whether your production data meets …

PCB Drill File may refer: PCB NC formats: A collection of widely used drill file formats in PCB production. PCB NC drill files convey PCB drilling and routing information. The NC formats were originally designed by CNC drill and route …

Dry Film Solder Mask (DFSM) is a water-based or solvent-based permanent material, which is packaged in rolls, the thicknesses are always 75μm and 100μm. Application: Protection against oxidation of printed circuit board Prevents solder bridges forming between closely spaced solder …

What Is DSBGA?   Die Size Ball Grid Array (DSBGA), also known as Wafer Level Chip Scale Package (WLCSP), refers to packaging an IC in wafer form, in contrast to packaging an IC after it has been singulated from the …

DSOP Advance, a Thermally Enhanced Double Side Cooling Package, which improved the efficiency of power supply for high-current applications. DSOP Advance has a metallic plate (E-Pad) on the top of the packaging to dissipate heat from the chips. Improved heat …

What’s DSP Chip?   A Digital Signal Processor (DSP) is a specialized microprocessor chip, with its architecture optimized for the operational needs of digital signal processing, usually in real-time. DSPs can also be used to perform general-purpose computations; however, they …

What Is Dual in-line?   In microelectronics, a dual in-line package (DIP or DIL), or dual in-line pin package (DIPP) is an electronic component package with rectangle housing and two parallel rows of electrical connecting pins. The package may be …

Added non-functional conductors that help achieve plating balance. See Thieving Pads.