Chip package is the housing or carrier that IC chips are placed in. The chip package is then either plugged into (socket mount) or soldered onto (surface mount) the printed circuit board. Creating a mounting for a chip might seem trivial, but chip packaging is a complicated industry. Being able to provide more interconnections to a bare chip (bare die) that is increasingly shrinking in size is an ever-present problem. In addition, smaller package sizes allow more chips to be placed inside phones and other handheld devices. See BGA, CDIP, CERDIP, CERQUAD, CLCC, DIP, package on package (POP), PLCC, QFP, MCM, SOP, SOIC, SOJ, and TSOP.
Same as IC Package.
The semiconductor industry manufactures a very huge variety of integrated circuits that have different packaging requirements. Package attributes that are taken into consideration when choosing a package type for a particular semiconductor device include: size, lead count, power dissipation, field operating conditions, and of course, cost. Popular IC chip package types used in the semiconductor industry today are presented in following figure.
IC Chip Packages